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12年坚持捍卫民族电工精工品质，千万次重复，品质始终如一，从模具到材料加工
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Four layers of soft and hard bonding board
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Plate type： Four layers of soft and hard bonding board
Product process： Chemical nickel gold, green oil
Process parameter： Ni：2-3um、Au：0.045-0.075um
Base copper： 35um
Line width line spacing： 0.1/0.1±0.02mm
Minimum aperture： 0.25mm
Finished plate thickness： 0.99±0.1mm
Range of application： For precision instrument control panel/
- 产品参数
-
Plate type： Four layers of soft and hard bonding board
Product process： Chemical nickel gold, green oil
Process parameter： Ni：2-3um、Au：0.045-0.075um
Base copper： 35um
Line width line spacing： 0.1/0.1±0.02mm
Minimum aperture： 0.25mm
Finished plate thickness： 0.99±0.1mm
Range of application： For precision instrument control panel/