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12年坚持捍卫民族电工精工品质，千万次重复，品质始终如一，从模具到材料加工
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0756-5160999
0756-5160999
xydzfpc008@xydzfpc.com
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13705 Rotating shaft FPC (eight-layer board - multi-layer board)
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Plate type： 13705 Rotating shaft FPC (eight-layer board - multi-layer board)
Product process： Chemical nickel gold
Process parameter： Ni：2-3um、Au：0.025-0.075um
Base copper： 12um
Line width line spacing： 0.1/0.08±0.02mm
Minimum aperture： 0.25mm
Finished plate thickness： 0.5±0.03mm
Range of application： For 4G flip phone communication equip
- 产品参数
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Plate type： 13705 Rotating shaft FPC (eight-layer board - multi-layer board)
Product process： Chemical nickel gold
Process parameter： Ni：2-3um、Au：0.025-0.075um
Base copper： 12um
Line width line spacing： 0.1/0.08±0.02mm
Minimum aperture： 0.25mm
Finished plate thickness： 0.5±0.03mm
Range of application： For 4G flip phone communication equip