EQUIPMENT
12年坚持捍卫民族电工精工品质，千万次重复，品质始终如一，从模具到材料加工
设备分类
Equipment classification
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CONTACT US
0756-5160999
0756-5160999
xydzfpc008@xydzfpc.com
West 1-3 / F, No. 12, Yangqing Street, Jing 'an Xinqing Industrial Park, Doumen District, Zhuhai
扫一扫业务联系
SMT machine
Equipment capacity :(30 sets)
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·： Component type: Chip R/C/L; IC. BGA
·： Object Substrate: L50*W50mm to L500*W460mm
·： HS: Chip 0201 (metric system) ~6mm (H: 2mm)
·： MF:0402 55mm(H15mm) IC,Connector(pin spacing 0.25mm), ※BGA,CSP(ball spacing 0.3mm)
·： Mounting capacity: HS: 80000 CPH, MF: 60000 CPH
·： Mounting accuracy: ±25um(μ+3σ)
·： Type of components: 80 kinds (converted to 8mm coil)
- 设备参数
-
·： Component type: Chip R/C/L; IC. BGA
·： Object Substrate: L50*W50mm to L500*W460mm
·： HS: Chip 0201 (metric system) ~6mm (H: 2mm)
·： MF:0402 55mm(H15mm) IC,Connector(pin spacing 0.25mm), ※BGA,CSP(ball spacing 0.3mm)
·： Mounting capacity: HS: 80000 CPH, MF: 60000 CPH
·： Mounting accuracy: ±25um(μ+3σ)
·： Type of components: 80 kinds (converted to 8mm coil)